Resin Designs UV 165-183 is uniquely designed for thick applications as both an adhesive and encapsulant where UL V0 fire ratings are critical. The products properties include:
B-stage epoxy films for clean reliable bonding/thermal and electrical conductivity
Most of us are familiar with epoxy adhesives and coatings, especially those of us within the electronics and medical device industries. We have all seen and often used two-component liquid epoxies. They are provided in syringes or pails for dispensing as adhesives, sealants, gaskets, and coatings. There is, however, a lesser known relative that can be cleaner, more consistent, environmentally friendly, and capable of unique properties such as thermal and electrical conductivity. It is known as B-stage epoxy film.
Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.
Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.
Customers of Resin Designs, a manufacturer of advanced adhesives and sealants, frequently approach the company with the following questions:
Do you have a product that blocks water and other fluids from wicking down wires?
How about something that’ll stop liquids from getting into solder joints?
Can you help provide a seal for mated contacts that can be removed and repaired?
Unlike thermoplastic alternatives such as hot melt adhesives, cured thermosetting epoxies will not re-flow or melt when heated. Instead, epoxies will undergo a transition from a hard-rigid state to a more pliable, rubbery state. The temperature range during which this transition takes place is known as the glass transition temperature, Tg.
A common limiting factor in the advancement of electronics systems is heat. The need to manage heat removal with a cost effective solution is a significant driver in the design of many electronic devices. Thermal interfaces play a huge factor in a device’s operation both in performance and reliability. Thermal interface materials (also referenced as a “TIM”) are mostly thermally conductive, ceramic-filled systems with organic or silicone binders added to make them flowable for dispensing and processing. These materials can be used to accelerate heat dissipation and give the cost-effective method engineers need for flexibility to reduce overall size of the package.
Topics: Thermal Interface Materials
A majority of manufacturers, including Resin Designs, understands that new technology is frequently misunderstood. For example, let’s circle back to 15 years ago when suppliers of LEDs believed that this light source could cure UV adhesives more cost efficiently than mercury bulbs, metal-halide bulbs and electrodeless bulbs. Manufacturers also believed the following: