For Immediate Release 

Resin Designs, a division of Chase Corporation, announces positive test results for their latest, lowest viscosity ThermoSink 35-7 thermally conductive electronics potting material. 

Recent independent testing has confirmed that ThermoSink 35-7 has met requirements under the testing protocol:

Topics: Thermosink

For Immediate Release 

Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material. 

Recent independent testing has confirmed that ThermoSink 35-6 has met requirements under the testing protocol- 

ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment”

Topics: Thermal Interface Materials, Thermosink, Thermal Conductivity, Silicones, Thermally Conductive Silicones

Liquid, optically clear adhesives (LOCA) provide superior optical enhancement and anti-glare properties in the manufacture of liquid crystal displays. The design of LOCA adhesives must take into account long-term exposure to environmental conditions such as light, temperature, humidity, and mechanical shock. Resin Designs chemists have devised a family of products for both screen face adhesion and edge sealing that have been fully tested to assure clarity and adhesion are maintained over time.

Topics: Adhesive Solutions, LOCA, Display Adhesives, LCD

There are a lot of alternatives out there for sealing, bonding, and gasketing enclosures. The process of choosing the correct solution for your needs can be daunting.

Topics: EMI conductive gaskets, EMI gel rope gaskets, Sealants

Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics’ thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity. 

Topics: Resin Designs, Thermoplastic, Thermosink

Topics: Resin Designs, Expo Show, AXIS Medical Adhesives

Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.

Topics: Thermal Interface Materials, Thermoplastic