For Immediate Release
Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material.
Recent independent testing has confirmed that ThermoSink 35-6 has met requirements under the testing protocol-
ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment”
