Resin Designs UV 165-183 is uniquely designed for thick applications as both an adhesive and encapsulant where UL V0 fire ratings are critical. The products properties include:
Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.
Customers of Resin Designs, a manufacturer of advanced adhesives and sealants, frequently approach the company with the following questions:
Do you have a product that blocks water and other fluids from wicking down wires?
How about something that’ll stop liquids from getting into solder joints?
Can you help provide a seal for mated contacts that can be removed and repaired?
Unlike thermoplastic alternatives such as hot melt adhesives, cured thermosetting epoxies will not re-flow or melt when heated. Instead, epoxies will undergo a transition from a hard-rigid state to a more pliable, rubbery state. The temperature range during which this transition takes place is known as the glass transition temperature, Tg.