Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics’ thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity.
Topics: Resin Designs, Thermoplastic, Thermosink
Topics: Resin Designs, Expo Show, AXIS Medical Adhesives
Axis 310 and Axis 310-W are the most recent additions to Resin Designs’ growing line of medically tested and qualified adhesives. Both products are single component epoxies for simplicity in application. Their heat curing chemistry provides added temperature and chemical resistance properties. These adhesives bond to a wide range of substrates typically found in the design of high-performance medical devices.
Topics: Resin Designs, Adhesive Solutions, Curable Adhesive
Resin Designs UV 165-183 is uniquely designed for thick applications as both an adhesive and encapsulant where UL V0 fire ratings are critical. The products properties include:
Topics: Resin Designs, Adhesive Solutions, Curable Adhesive
Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.
Topics: Resin Designs, Thermosink, Thermal Conductivity, Potting Material
Customers of Resin Designs, a manufacturer of advanced adhesives and sealants, frequently approach the company with the following questions:
Topics: Resin Designs, Gel Tek
Unlike thermoplastic alternatives such as hot melt adhesives, cured thermosetting epoxies will not re-flow or melt when heated. Instead, epoxies will undergo a transition from a hard-rigid state to a more pliable, rubbery state. The temperature range during which this transition takes place is known as the glass transition temperature, Tg.
Topics: Resin Designs, Epoxy Adhesives, Glass Transition
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