Resin Designs TechFilm is a product line consisting of high-performance, partially cured epoxy adhesive films. These specialized film adhesives are designed as alternatives to two-part liquid epoxies. Techfilm advantages include clean, precise bond thickness and borders, low and high-temperature resiliency, and harsh environmental conditions resistance. 

An important question arises: what makes these films different than opting for traditional adhesive coatings? Let's review the unique strengths of TechFilm adhesives and discuss how to best implement their unique application process.

Epoxy chemistry is certainly not new, and this technology has proven itself across a wide range of industries and applications. Epoxies have demonstrated their value due to desirable characteristics, such as:

• Chemical and environmental resistance 
• Adhesion to a wide variety of substrates 
• Excellent peel and shear strength 
• Customizable open and curing times 
• Temperature resistance 

There are, however, challenges associated with the use of liquid, two-component epoxies. They can often require expensive and complex application equipment with precise mix ratio control. Liquid epoxies can also require fairly long curing times, making their use in higher volume circumstances less than ideal. Other than that, they can also be just plain messy! 

In order to address some of these weaknesses of liquid epoxies, an alternative approach is available in the form of B-stage epoxy films.

In our interconnected world, electronic devices have become an integral part of our daily lives. However, this surge in technological advancements has also given rise to electromagnetic interference (EMI) issues. EMI can disrupt the proper functioning of electronic devices, leading to performance degradation and potential damage. This is a very sensitive issue, especially in the aerospace and transportation industries. To combat this problem, multi-functional EMI shielding gaskets and ropes have emerged as an innovative solution. In this blog post, we will explore the benefits of these shielding components and their significance in various industries.

Heat makes electronics age faster. That's nothing new. The control and management of heat has always been a critical consideration in the design of printed circuit boards (PCBs) and other electronic devices. What is relatively new, however, is the dramatic increases in voltages, currents, and processing speeds demanded by burgeoning industries.

HEAT! It's public enemy number one for modern electronics and (especially) printed circuit boards (PCBs). If you've been in the electronics game for as long as we have, you're probably saying "Heat has always been an issue we've dealt with, so what's changed?" For one, more tightly packed, heat-generating board components are being designed. Component spacing and trace gaps continue to shrink like vacant land in Manhattan.

Permanent magnet motors have been around for a very long time. Nevertheless, the technology and chemistry involved in their production have developed tremendously. This is due to a wide range of market factors, including:

The use of thermally conductive polymers has been accelerating in recent years. This growth is being driven by increased demand and technical advances in applications, such as:

• EV battery cooling
• High voltage EV and yard tool chargers
• Miniaturization of trace spacing and gaps on PCBs
• And many more….

Electronics connectors have evolved from simple wire-to-wire interface components to those capable of transferring enormous volumes of data required for applications such as video and autonomous driving. Connectors are also being exposed to more demanding environmental conditions such as liquids, noxious gases, extreme temperatures, mechanical shock, and vibration. In order to improve reliability and longevity, many industries including aerospace and automotive have chosen to include flexible thermoplastic gel-pads in designs.

A lot of scary things happen underground. It can be wet, dirty, smelly, and filled with all sorts of creepy-crawly things. Not exactly the ideal environment for your carefully designed and often sensitive electrical or mechanical devices. At Chase’s Resin Designs and HumiSeal, we have been in the business of providing protection for underground devices for decades. We have developed a wide range of durable, rugged polymer solutions. They can be used as adhesives, gaskets, and coatings to keep even the nastiest of underground invaders at bay.

Medical device and componentry, ranging from needle/catheter assemblies to more complex designs, continue to explode in popularity and functionality. Recent pandemic events have, of course, contributed to a huge upsurge in urgency and demand for hypodermic needles. The call for high performance and reliability has not abated, but there is now the additional requirement for high speed and cost efficiency at a level never before seen.