Nobody likes to get too hot, and if your high-tech electronics could talk, they’d say they feel the same way. Heat is their enemy. It reduces longevity and limits reliability, two non-negotiable properties in electronics. The lack of one or both can literally mean the difference between life and death in applications such as autonomous driving and aerospace controls.
Adoption of plug in -electric vehicles (EVs) has been slower than many expected, but there is little question the next few years will see adoption accelerate. Your hypersensitive dog will have to find new visitors to harass when your delivery drivers arrive without notice, driving to your door silently in all-electric commercial vans. Many of your favorite suppliers and stores have already ordered these vehicles. Game-changing battery and charging developments are eliminating range anxiety, and autonomous driving controls and safety innovations are in the final stages of building our trust.
Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.
A common limiting factor in the advancement of electronics systems is heat. The need to manage heat removal with a cost effective solution is a significant driver in the design of many electronic devices. Thermal interfaces play a huge factor in a device’s operation both in performance and reliability. Thermal interface materials (also referenced as a “TIM”) are mostly thermally conductive, ceramic-filled systems with organic or silicone binders added to make them flowable for dispensing and processing. These materials can be used to accelerate heat dissipation and give the cost-effective method engineers need for flexibility to reduce overall size of the package.
Topics: Thermal Interface Materials