Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics’ thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity.
Nobody likes to get too hot, and if your high-tech electronics could talk, they’d say they feel the same way. Heat is their enemy. It reduces longevity and limits reliability, two non-negotiable properties in electronics. The lack of one or both can literally mean the difference between life and death in applications such as autonomous driving and aerospace controls.
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Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.