Heat makes electronics age faster. That's nothing new. The control and management of heat has always been a critical consideration in the design of printed circuit boards (PCBs) and other electronic devices. What is relatively new, however, is the dramatic increases in voltages, currents, and processing speeds demanded by burgeoning industries.
For Immediate Release
Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material.
Recent independent testing has confirmed that ThermoSink 35-6 has met requirements under the testing protocol-
ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment”
Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics’ thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity.
Nobody likes to get too hot, and if your high-tech electronics could talk, they’d say they feel the same way. Heat is their enemy. It reduces longevity and limits reliability, two non-negotiable properties in electronics. The lack of one or both can literally mean the difference between life and death in applications such as autonomous driving and aerospace controls.
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Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.