Choosing the Best Thermally Conductive Polymer for Your Application

Posted by Dan Griffin on Mar 31, 2023 3:21:54 PM

HEAT! It's public enemy number one for modern electronics and (especially) printed circuit boards (PCBs). If you've been in the electronics game for as long as we have, you're probably saying "Heat has always been an issue we've dealt with, so what's changed?" For one, more tightly packed, heat-generating board components are being designed. Component spacing and trace gaps continue to shrink like vacant land in Manhattan.

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Topics: Resin Designs, Thermoplastic, thermal polymers

Resin Designs ThermoSink Demonstrates Successes in Multiple Thermal Management Applications

Posted by Chase Corp Editor on Feb 24, 2022 3:43:55 PM

Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity. 

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Topics: Resin Designs, Thermoplastic, Thermosink

7 Benefits of Pre-Cured Pads in Thermal Interface Applications

Posted by Chase Corp Editor on May 15, 2018 10:00:00 AM

Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.

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Topics: Thermal Interface Materials, Thermoplastic

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