Resin Designs ThermoSink Demonstrates Successes in Multiple Thermal Management Applications

Posted by Chase Corp Editor on Feb 24, 2022 3:43:55 PM

Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics thermal management materials. The ThermoSink name includes a number of products of various viscosities, hardness, and thermal characteristics. All products are two-component (1:1 ratio mix), heavily filled silicone with high thermal conductivity. 

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Topics: Resin Designs, Thermoplastic, Thermosink

7 Benefits of Pre-Cured Pads in Thermal Interface Applications

Posted by Kris Hanson on May 15, 2018 10:00:00 AM

Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.

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Topics: Thermal Interface Materials, Thermoplastic

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