In our previous blog we introduced one of our products GT-1030 as an effective solution to problems related to sealing and protecting wire bundles and harnesses. In this blog, we will provide a step-by-step process in how to effectively waterproof small wire bundles.
Resin Designs receives regular inquiries regarding products that can seal wire bundles, harnesses and connectors. Market sectors and applications vary from automotive connectors to consumer appliances, LED connectors/housings in lighting industries as well as directional drilling cables in gas and oil exploration. Below are examples of the inquiries:
Thermally conductive silicone products are widely used in the electronics industry to radiate heat away from locales for component survivability while maintaining optimum operating temperatures. For potting and encapsulation applications, circuit board engineers typically specify flowable products that will quickly surround the components after dispensing and become solid at room temperature within an hour or less.
Customers of Resin Designs, a manufacturer of advanced adhesives and sealants, frequently approach the company with the following questions:
Do you have a product that blocks water and other fluids from wicking down wires?
How about something that’ll stop liquids from getting into solder joints?
Can you help provide a seal for mated contacts that can be removed and repaired?
A common limiting factor in the advancement of electronics systems is heat. The need to manage heat removal with a cost effective solution is a significant driver in the design of many electronic devices. Thermal interfaces play a huge factor in a device’s operation both in performance and reliability. Thermal interface materials (also referenced as a “TIM”) are mostly thermally conductive, ceramic-filled systems with organic or silicone binders added to make them flowable for dispensing and processing. These materials can be used to accelerate heat dissipation and give the cost-effective method engineers need for flexibility to reduce overall size of the package.
Topics: Thermal Interface Materials