A common limiting factor in the advancement of electronic systems is heat. The need to manage heat removal with a cost-effective solution is a significant driver in the design of many electronic devices. Thermal interfaces play a huge factor in a device’s operation both in performance and reliability. Thermal interface materials (also referenced as a “TIM”) are mostly thermally conductive, ceramic-filled systems with organic or silicone binders added to make them flowable for dispensing and processing. These materials can be used to accelerate heat dissipation and give the cost-effective method engineers need for flexibility to reduce the overall size of the package.

Electronics and PCB protection can be complex. There is rarely only one way to enhance your product’s durability and warranty performance. Humiseal conformal coatings provide excellent protection in demanding conditions that include thermal and mechanical shock, moisture and humidity, and liquid chemicals and vapor.   

Liquid optically clear adhesive (LOCA) is an essential component in the assembly of liquid crystal displays (LCDs). Its unique properties offer a multitude of advantages that enhance the efficiency, accuracy, optical clarity, and overall performance of the LCD assembly process. Among these advantages, the low viscosity of LOCA plays a particularly critical role in ensuring the production of high-quality LCD displays. 

Resin Designs TechFilm is a product line consisting of high-performance, partially cured epoxy adhesive films. These specialized film adhesives are designed as alternatives to two-part liquid epoxies. Techfilm advantages include clean, precise bond thickness and borders, low and high-temperature resiliency, and harsh environmental conditions resistance. 

An important question arises: what makes these films different than opting for traditional adhesive coatings? Let's review the unique strengths of TechFilm adhesives and discuss how to best implement their unique application process.

Epoxy chemistry is certainly not new, and this technology has proven itself across a wide range of industries and applications. Epoxies have demonstrated their value due to desirable characteristics, such as:

• Chemical and environmental resistance 
• Adhesion to a wide variety of substrates 
• Excellent peel and shear strength 
• Customizable open and curing times 
• Temperature resistance 

There are, however, challenges associated with the use of liquid, two-component epoxies. They can often require expensive and complex application equipment with precise mix ratio control. Liquid epoxies can also require fairly long curing times, making their use in higher volume circumstances less than ideal. Other than that, they can also be just plain messy! 

In order to address some of these weaknesses of liquid epoxies, an alternative approach is available in the form of B-stage epoxy films.

In our interconnected world, electronic devices have become an integral part of our daily lives. However, this surge in technological advancements has also given rise to electromagnetic interference (EMI) issues. EMI can disrupt the proper functioning of electronic devices, leading to performance degradation and potential damage. This is a very sensitive issue, especially in the aerospace and transportation industries. To combat this problem, multi-functional EMI shielding gaskets and ropes have emerged as an innovative solution. In this blog post, we will explore the benefits of these shielding components and their significance in various industries.

Heat makes electronics age faster. That's nothing new. The control and management of heat has always been a critical consideration in the design of printed circuit boards (PCBs) and other electronic devices. What is relatively new, however, is the dramatic increases in voltages, currents, and processing speeds demanded by burgeoning industries.

HEAT! It's public enemy number one for modern electronics and (especially) printed circuit boards (PCBs). If you've been in the electronics game for as long as we have, you're probably saying "Heat has always been an issue we've dealt with, so what's changed?" For one, more tightly packed, heat-generating board components are being designed. Component spacing and trace gaps continue to shrink like vacant land in Manhattan.

Permanent magnet motors have been around for a very long time. Nevertheless, the technology and chemistry involved in their production have developed tremendously. This is due to a wide range of market factors, including:

For Immediate Release 

Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material. 

Recent independent testing has confirmed that ThermoSink 35-6 has met requirements under the testing protocol- 

ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment”