Resin Designs TechFilm is a product line consisting of high-performance, partially cured epoxy adhesive films. These specialized film adhesives are designed as alternatives to two-part liquid epoxies. Techfilm advantages include clean, precise bond thickness and borders, low and high-temperature resiliency, and harsh environmental conditions resistance. 

An important question arises: what makes these films different than opting for traditional adhesive coatings? Let's review the unique strengths of TechFilm adhesives and discuss how to best implement their unique application process.

Epoxy chemistry is certainly not new, and this technology has proven itself across a wide range of industries and applications. Epoxies have demonstrated their value due to desirable characteristics, such as:

• Chemical and environmental resistance 
• Adhesion to a wide variety of substrates 
• Excellent peel and shear strength 
• Customizable open and curing times 
• Temperature resistance 

There are, however, challenges associated with the use of liquid, two-component epoxies. They can often require expensive and complex application equipment with precise mix ratio control. Liquid epoxies can also require fairly long curing times, making their use in higher volume circumstances less than ideal. Other than that, they can also be just plain messy! 

In order to address some of these weaknesses of liquid epoxies, an alternative approach is available in the form of B-stage epoxy films.

In our interconnected world, electronic devices have become an integral part of our daily lives. However, this surge in technological advancements has also given rise to electromagnetic interference (EMI) issues. EMI can disrupt the proper functioning of electronic devices, leading to performance degradation and potential damage. This is a very sensitive issue, especially in the aerospace and transportation industries. To combat this problem, multi-functional EMI shielding gaskets and ropes have emerged as an innovative solution. In this blog post, we will explore the benefits of these shielding components and their significance in various industries.

Heat makes electronics age faster. That's nothing new. The control and management of heat has always been a critical consideration in the design of printed circuit boards (PCBs) and other electronic devices. What is relatively new, however, is the dramatic increases in voltages, currents, and processing speeds demanded by burgeoning industries.

HEAT! It's public enemy number one for modern electronics and (especially) printed circuit boards (PCBs). If you've been in the electronics game for as long as we have, you're probably saying "Heat has always been an issue we've dealt with, so what's changed?" For one, more tightly packed, heat-generating board components are being designed. Component spacing and trace gaps continue to shrink like vacant land in Manhattan.

Permanent magnet motors have been around for a very long time. Nevertheless, the technology and chemistry involved in their production have developed tremendously. This is due to a wide range of market factors, including:

For Immediate Release 

Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material. 

Recent independent testing has confirmed that ThermoSink 35-6 has met requirements under the testing protocol- 

ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment”

The use of thermally conductive polymers has been accelerating in recent years. This growth is being driven by increased demand and technical advances in applications, such as:

• EV battery cooling
• High voltage EV and yard tool chargers
• Miniaturization of trace spacing and gaps on PCBs
• And many more….

Liquid, optically clear adhesives (LOCA) provide superior optical enhancement and anti-glare properties in the manufacture of liquid crystal displays. The design of LOCA adhesives must take into account long-term exposure to environmental conditions such as light, temperature, humidity, and mechanical shock. Resin Designs chemists have devised a family of products for both screen face adhesion and edge sealing that have been fully tested to assure clarity and adhesion are maintained over time.

There are a lot of alternatives out there for sealing, bonding, and gasketing enclosures. The process of choosing the correct solution for your needs can be daunting.